| PART |
Description |
Maker |
| DSP56371 DSP56371D |
high density CMOS device
|
MOTOROLA[Motorola, Inc]
Motorola Inc
|
| ATV2500H ATV2500H-25DC ATV2500H-25DI ATV2500H-25DM |
120 OHM 1% 1/8 W
High-Density UV-Erasable Programmable Logic Device UV PLD, 35 ns, CDIP40
High-Density UV-Erasable Programmable Logic Device OT PLD, 35 ns, PQCC44
High-Density UV-Erasable Programmable Logic Device UV PLD, 35 ns, CQCC44
High-Density UV-Erasable Programmable Logic Device OT PLD, 30 ns, PDIP40
High-Density UV-Erasable Programmable Logic Device UV PLD, 30 ns, CQCC44
|
ATMEL[ATMEL Corporation]
Atmel Corp.
Atmel, Corp.
|
| DSP56374 DSP56374PB DSP56374PB_D DSP56374UM DSP563 |
high density CMOS device with 3.3 V inputs and outputs
|
MOTOROLA[Motorola, Inc]
|
| ATV2500B-15KM/883 ATV2500BL-20KM/883 ATV2500BQL-30 |
High-Speed High-Density UV Erasable Programmable Logic Device OT PLD, 20 ns, PDIP40
High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 30 ns, CQCC44
High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 15 ns, CQCC44
High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 25 ns, CQCC44
High-Speed High-Density UV Erasable Programmable Logic Device OT PLD, 25 ns, PQCC44
High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 25 ns, CDIP40
High-Speed High-Density UV Erasable Programmable Logic Device OT PLD, 25 ns, PDIP40
ER 4C 4#8 SKT RECP BOX
Seals
Circular Connector; MIL SPEC:MIL-C-5015 E/F/R; Body Material:Aluminum Alloy; Series:MS3102; No. of Contacts:14; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle; Gender:Female RoHS Compliant: No
Circular Connector; No. of Contacts:14; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:22; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:22-19 RoHS Compliant: No
ER 14C 14#16 SKT RECP
CONTROL KNOB RoHS Compliant: Yes
ER 3C 3#8 SKT RECP BOX
ER 7C 7#16 PIN RECP
ER 3C 1#16 2#8 PIN RECP BOX
ER 9C 9#16 PIN RECP
|
Atmel, Corp.
Atmel Corp.
http://
ATMEL Corporation
|
| XCF128XFTG64C DS617 XCF32PV0G48C |
Platform Flash XL High-Density Configuration and Storage Device 8M X 16 FLASH 1.8V PROM, 85 ns, PBGA64
Platform Flash XL High-Density Configuration
|
Xilinx, Inc.
|
| MACH110-12 MACH110-14 MACH110-15 MACH110-18 MACH11 |
High-Density EE CMOS Programmable Logic
|
Lattice Semiconductor
AMD[Advanced Micro Devices]
|
| MACH110-12JC MACH110-15JC MACH110-20JC MACH110-12 |
High-Density EE CMOS Programmable Logic
|
LATTICE[Lattice Semiconductor]
|
| MACH210-12 MACH210-12JI MACH210-14JI MACH210-15 MA |
High-Density EE CMOS Programmable Logic
|
AMD[Advanced Micro Devices]
Lattice Semiconductor
|
| AM7200-25 AM7200-25JC AM7200-25PC AM7200-25RC AM72 |
HIGH DENSITY FIRST-IN FIRST-OUT (FIFO) 256 X 9-BIT CMOS MEMORY
|
Advanced Micro Devices
|
| MACH220-20JC |
High-Density EE CMOS Programmable Logic EE PLD, 20 ns, PQCC68
|
Lattice Semiconductor Corporation
Lattice Semiconductor, Corp.
|
| MACH130-20JC MACH130-15JC |
High-Density EE CMOS Programmable Logic EE PLD, 15 ns, PQCC84
|
Lattice Semiconductor Corporation
Lattice Semiconductor, Corp.
|
